ISOLA 370HR PCB - 6-Layer High-Performance FR-4 PCB with ENIG Finish

1. Introduction to ISOLA 370HR

ISOLA 370HR laminates and prepregs, developed by Polyclad, utilize a patented high-performance epoxy resin system with a glass transition temperature (Tg) of 180°C. This multifunctional FR-4 resin is specifically engineered for multilayer Printed Circuit Board (PCB) applications that demand exceptional thermal performance and reliability. The laminates and prepregs are crafted with high-quality E-glass fabric, ensuring excellent resistance to Conductive Anodic Filament (CAF) formation. 370HR delivers outstanding thermal performance with a low Coefficient of Thermal Expansion (CTE), along with mechanical, chemical, and moisture resistance that meets or surpasses traditional FR-4 materials.

Utilized in countless PCB designs, 370HR is recognized as best in class for thermal reliability, CAF performance, processing ease, and effectiveness in sequential lamination processes.

 2. Properties
-Glass Transition Temperature (Tg: 180°C (measured by DSC)
-Decomposition Temperature (Td: 340°C (5% weight loss measured by TGA)
-Time to Delaminat: T260 of 60 minutes, T288 of 30 minutes (measured by TMA with copper removed)
-Coefficient of Thermal Expansion (CTE: Pre-Tg Z-Axis of 45 ppm/°C, X/Y-Axis of 13/14 ppm/°C
-Thermal Conductivit: 0.4 W/mK
-Dielectric Constant (DK: 3.92 at 5 GHz and 10 GHz; 4.24 at 100 MHz; 4.17 at 1 GHz; 4.04 at 2 GHz
-Dissipation Factor (Df: 0.025 at 5 GHz and 10 GHz; 0.015 at 100 MHz; 0.0161 at 1 GHz; 0.021 at 2 GHz
-Dielectric Breakdow: Greater than 50 kV
-Comparative Tracking Index (CTI: 175V-249V
-Moisture Absorptio: 0.15%
-Flammability Ratin: UL94-V0 for laminate and laminated prepreg

 3. Attributes

- High thermal reliability
- High-density interconnect capabilities

4. 6-Layer PCB Stackup (370HR)

The stackup for the 370HR PCB includes various signal and power layers, with the total thickness reaching 62.0 mils. Specifics of each layer include top and bottom signal layers, ground planes, and power layers.

5. PCB Construction Details

-Board Dimension: 40 mm x 55 mm (1 piece, +/- 0.15 mm)
-Minimum Trace/Spac: 4/4 mils
-Minimum Hole Siz: 0.2 mm
-Blind Via: None
-Finished Board Thicknes: 1.6 mm
-Finished Copper Weigh: 1 oz (1.4 mils) for both inner and outer layers
-Via Plating Thicknes: 20 µm
-Surface Finis: ENIG
-Silkscree: White on both top and bottom layers
-Solder Mas: Green on both top and bottom layers
-Impedance Contro: 50 ohm on 10 mil traces
-Electrical Testin: 100% testing performed prior to shipment

6. PCB Statistics -Component: 31
-Total Pad: 46
-Through-Hole Pad: 29
-Top SMT Pad: 17
-Bottom SMT Pad: 0
-Via: 24
-Net: 5

 7. Type of Artwork Supplied
Gerber RS-274-X format.

 8. Accepted Standard
IPC-Class-2 compliance.

 9. Availability
Available worldwide.

 10. Typical Applications
- Computing, Storage & Peripherals
- Consumer Electronics
- Networking & Communications
- Medical, Industrial, and Instrumentation
- Automotive and Transportation
- Aerospace and Defense